Compact Double-Side Liquid-Impingement-Cooled Integrated Power Electronic Module

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  2. Clare Johnson
Author(s)Johnson CM, Buttay C, Rashid SJ, Udrea F, Amaratunga GAJ, Ireland P, Malhan RK
Editor(s)
Publication type Conference Proceedings (inc. Abstract)
Conference Name19th International Symposium on Power Semiconductor Devices and IC's, ISPSD
Conference LocationJeju, Korea
Year of Conference2007
Legacy Date27-31 May 2007
Volume
Pages53-56
ISBN1424410967
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This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper.
PublisherIEEE
URLhttp://dx.doi.org/10.1109/ISPSD.2007.4294930
DOI10.1109/ISPSD.2007.4294930
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