Packaging of a silicon-based biochip

  1. Lookup NU author(s)
  2. Dr Pedro Ortiz
  3. Dr Neil Keegan
  4. Julia Spoors
  5. Dr John Hedley
  6. Professor Calum McNeil
Author(s)Velten T, Biehl M, Haberer W, Koch T, Ortiz P, Keegan N, Spoors J, Hedley J, McNeil C
Editor(s)
Publication type Conference Proceedings (inc. Abstract)
Conference NameReliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Conference LocationSan Jose, California, USA
Year of Conference2009
Legacy Date28 January 2009
Volume7206
Pages720603
0277786X
ISBN9780819474520
Full text for this publication is not currently held within this repository. Alternative links are provided below where available.
PublisherSPIE
URLhttp://dx.doi.org/10.1117/12.813500
DOI10.1117/12.813500
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