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Packaging of a silicon-based biochip
Lookup NU author(s)
Dr Pedro Ortiz
Dr Neil Keegan
Julia Spoors
Dr John Hedley
Professor Calum McNeil
Author(s)
Velten T, Biehl M, Haberer W, Koch T, Ortiz P, Keegan N, Spoors J, Hedley J, McNeil C
Editor(s)
Publication type
Conference Proceedings (inc. Abstract)
Conference Name
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Conference Location
San Jose, California, USA
Year of Conference
2009
Date
28 January 2009
Volume
7206
Pages
720603
0277786X
ISBN
9780819474520
Full text for this publication is not currently held within this repository. Alternative links are provided below where available.
Publisher
SPIE
URL
http://dx.doi.org/10.1117/12.813500
DOI
10.1117/12.813500
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