Accurate Surface-to-Bulk Feature Alignment and Feature Size Preservation During Double-Sided Wafer Processing Using C4F8 Plasma Polymer for the Fabrication of Electrostatically Actuated Cantilever Devices

  1. Lookup NU author(s)
  2. Dr Sunilkumar Rana
  3. Ivano Gregoratto
  4. Pedro Ortiz Bahamon
  5. Dr Alun Harris
  6. Professor James Burdess
  7. Professor Calum McNeil
Author(s)Rana S, Gregoratto I, Ortiz PM, Harris AJ, Burdess JS, McNeil CJ
Publication type Article
JournalJournal of Microelectromechanical Systems
Year2010
Volume19
Issue4
Pages871-877
ISSN (print)1057-7157
ISSN (electronic)1941-0158
Full text for this publication is not currently held within this repository. Alternative links are provided below where available.
PublisherIEEE
URLhttp://dx.doi.org?10.1109/JMEMS.2010.2050678
DOI10.1109/JMEMS.2010.2050678
Actions    Link to this publication