Finite element analysis of copper wire bonding in integrated circuit devices

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  2. Norzalina Ismail
  3. Dr Kheng-Lim Goh
Author(s)Dastgir N, Pasbakhsh P, Guo NQ, Ismail N, Goh KL
Publication type Article
JournalAdvanced Materials Research
Year2012
Volume566
Issue
Pages293-299
ISSN (print)1022-6680
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PublisherTrans Tech Publications Ltd.
URLhttp://dx.doi.org/10.4028/www.scientific.net/AMR.566.293
DOI10.4028/www.scientific.net/AMR.566.293
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