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A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

Lookup NU author(s): Dr Stevin PramanaORCiD

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Abstract

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics. © 2009 Acta Materialia Inc.

Publication metadata

Author(s): Xu H, Liu C, Silberschmidt VV, Pramana SS, White TJ, Chen Z

Publication type: Article

Publication status: Published

Journal: Scripta Materialia

Year: 2009

Volume: 61

Issue: 2

Pages: 165-168

Print publication date: 01/07/2009

Online publication date: 21/03/2009

ISSN (print): 1359-6462

ISSN (electronic): 1872-8456

Publisher: Pergamon Press

URL: https://doi.org/10.1016/j.scriptamat.2009.03.034

DOI: 10.1016/j.scriptamat.2009.03.034

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