Calibration of MEMS-based test structures for predicting thermomechanical stress in integrated circuit interconnect structures

  1. Lookup NU author(s)
  2. Kai Wang
  3. Dr Alton Horsfall
  4. Professor Nick Wright
  5. Professor Anthony O'Neill
  6. Sorin Soare
  7. Professor Steve Bull
Author(s)dos Santos JMM, Wang K, Horsfall AB, Pina JCP, Wright NG, O'Neill AG, Soare SM, Bull SJ, Terry JG, Walton AJ, Gundlach AM, Stevenson JTM
Publication type Article
JournalIEEE Transactions on Device and Materials Reliability
Year2005
Volume5
Issue4
Pages713-719
ISSN (print)1530-4388
ISSN (electronic)1558-2574
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PublisherIEEE
URLhttp://dx.doi.org/10.1109/TDMR.2005.857218
DOI10.1109/TDMR.2005.857218
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