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Effective thermal conductivity of porous solder layers
Lookup NU author(s)
Dr Len Pritchard
Professor Paul Acarnley
Dr Christopher Johnson
Author(s)
Pritchard LS, Acarnley PP, Johnson CM
Publication type
Article
Journal
IEEE Transactions on Components and Packaging Technologies
Year
2004
Volume
27
Issue
2
Pages
259-267
ISSN (print)
1521-3331
ISSN (electronic)
1557-9972
Full text is available for this publication:
Full text file 1
Publisher
IEEE
URL
http://dx.doi.org/10.1109/TCAPT.2004.828584
DOI
10.1109/TCAPT.2004.828584
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