Test chip for the development and evaluation of sensors for measuring stress in metal interconnects

  1. Lookup NU author(s)
  2. Dr Alton Horsfall
  3. Sorin Soare
  4. Professor Nick Wright
  5. Professor Anthony O'Neill
  6. Professor Steve Bull
Author(s)Terry JG, Smith S, Walton AJ, Gundlach AM, Stevenson JTM, Horsfall AB, Wang K, Dos Santos JMM, Soare SM, Wright NG, O'Neill AG, Bull SJ
Publication type Article
JournalIEEE Transactions on Semiconductor Manufacturing
Year2005
Volume18
Issue2
Pages255-260
ISSN (print)0894-6507
ISSN (electronic)1476-5527
Full text is available for this publication:
PublisherIEEE
URLhttp://dx.doi.org/10.1109/TSM.2005.845096
DOI10.1109/TSM.2005.845096
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