Toggle Main Menu Toggle Search

Open Access padlockePrints

High temperature direct double side cooled inverter module for hybrid electric vehicle application

Lookup NU author(s): Dr Christopher Johnson, Peter Tappin

Downloads

Full text for this publication is not currently held within this repository. Alternative links are provided below where available.


Abstract

In this paper a novel approach to the design and fabrication of a high temperature inverter module for hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of the conventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over 200°C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, a SiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, double-sided cooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. The tiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wire bonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Both sides of the assembly are cooled directly using a high-performance liquid impingement system. Specific features of the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cycling life. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gate drives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3.


Publication metadata

Author(s): Buttay C, Johnson CM, Rashid J, Udrea F, Amaratunga GAJ, Tappin P, Wright N, Ireland P, Yamamoto T, Takeuchi Y, Malhan RK

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: 6th European Conference on Silicon Carbide and Related Materials (ECSCRM)

Year of Conference: 2007

Pages: 709-712

ISSN: 0255-5476

Publisher: Materials Science Forum: Trans Tech Publications Ltd

URL: http://dx.doi.org/10.4028/www.scientific.net/MSF.556-557.709

DOI: 10.4028/www.scientific.net/MSF.556-557.709

Library holdings: Search Newcastle University Library for this item

ISBN: 14226375


Share