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Evaluation of Energy-Recovering Interconnects for Low-Power 3D Stacked ICs

Lookup NU author(s): Panagiotis Asimakopoulos, Professor Alex Yakovlev

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Abstract

Energy-recovering schemes have been proposed in the literature as an alternative approach to low-power design, while their performance has been demonstrated to be extremely promising when driving large capacitive loads, such as clock distribution networks [1]. This work investigates the potential of the energy-recovering methodology for improving the energy efficiency of through-silicon via (TSV) interconnects in 3D ICs.


Publication metadata

Author(s): Asimakopoulos P, Van der Plas G, Yakovlev A, Marchal P

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: IEEE International Conference on 3D Systems Integration

Year of Conference: 2009

Pages: 110-114

Date deposited: 21/05/2010

Publisher: IEEE

URL: http://dx.doi.org/10.1109/3DIC.2009.5306581

DOI: 10.1109/3DIC.2009.5306581

Library holdings: Search Newcastle University Library for this item

ISBN: 9781424445110


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