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A thermal model for a multichip device with changing cooling conditions

Lookup NU author(s): Gareth James, Professor Volker Pickert

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Abstract

This paper describes the development of a thermal model for a multichip device cooled by a force cooled heatsink employing fan speed control. The model can be used to estimate the temperature of a device in a system where the thermal coupling between devices is significant and the characteristics of the heatsink are altered by the fan speed. The model is developed for a simplified experimental test configuration and is verified against practical results.


Publication metadata

Author(s): James G, Pickert V, Cade M

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: 4th IET International Conference on Power Electronics, Machines and Drives (PEMD 2008)

Year of Conference: 2008

Pages: 310-314

Publisher: Institution of Engineering and Technology

URL: http://dx.doi.org/10.1049/cp:20080533

DOI: 10.1049/cp:20080533

Library holdings: Search Newcastle University Library for this item

ISBN: 9780863419003


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