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Accurate Surface-to-Bulk Feature Alignment and Feature Size Preservation During Double-Sided Wafer Processing Using C4F8 Plasma Polymer for the Fabrication of Electrostatically Actuated Cantilever Devices

Lookup NU author(s): Dr Sunilkumar Rana, Ivano Gregoratto, Pedro Ortiz Bahamon, Dr Alun Harris, Emeritus Professor James Burdess, Emeritus Professor Calum McNeil

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Abstract

An accurate alignment of surface-to-bulk features (within +/- 2 mu m) during a double-sided silicon wafer processing can be extremely difficult. This is due to a combination of mask misalignment errors and unreliability of bulk etching techniques in translating the bulk feature shapes down to the surface side. In this paper, we present a fabrication process for an electrostatically actuated cantilever device where an accurate surface-to-bulk feature alignment is imperative to the operation of the device. The fabrication process compensates for the bulk etch-induced feature size variation and mask misalignment errors using a combination of self-aligning features and C4F8 plasma polymer passivation. [2009-0226]


Publication metadata

Author(s): Rana S, Gregoratto I, Ortiz PM, Harris AJ, Burdess JS, McNeil CJ

Publication type: Article

Publication status: Published

Journal: Journal of Microelectromechanical Systems

Year: 2010

Volume: 19

Issue: 4

Pages: 871-877

Print publication date: 01/08/2010

ISSN (print): 1057-7157

ISSN (electronic): 1941-0158

Publisher: IEEE

URL: http://dx.doi.org?10.1109/JMEMS.2010.2050678

DOI: 10.1109/JMEMS.2010.2050678


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