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Effect of fluorosurfactant on copper-tin reduction from methanesulphonic acid electrolyte

Lookup NU author(s): Naray PEWNIM, Professor Sudipta Roy

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Abstract

In this study, methanesulphonic acid electrolytes have been used to electrodeposit copper-tin alloys of different compositions to examine the effect of a fluorosurfactant additive on deposit composition. Experiments have been carried out at a rotating cylinder Hull cell as it allows the deposition of many alloy compositions over a wide range in a single experiment. The relative amounts of tin and copper in the deposit were controlled by fixing the ratio of copper to tin in the electrolyte as well as the addition of hydroquinone and a non-ionic fluorosurfactant additive. It was found that without the surfactant, metal oxides with a tin content of 35 wt-% were deposited. The addition of the surfactant eliminated metal oxides and deposits with a tin content of up to 85 wt-% could be plated.

Publication metadata

Author(s): Pewnim N, Roy S

Publication type: Article

Publication status: Published

Journal: Transactions of the Institute of Metal Finishing

Year: 2011

Volume: 89

Issue: 4

Pages: 206-209

Print publication date: 01/07/2011

ISSN (print): 0020-2967

ISSN (electronic): 1745-9192

Publisher: Maney Publishing

URL: http://dx.doi.org/10.1179/174591911X13082997023918

DOI: 10.1179/174591911X13082997023918

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