Lookup NU author(s): Dr Jishan Zhang,
Professor Brian Shaw
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Thermal stresses due to a mismatch between material properties may induce failure of a bonded interface. A simple model for linear dissimilar elastic bonded solids containing an interfacial Zener–Stroh crack under a uniform temperature shift is proposed. Its solution is derived. This result may provide some information about the interface defect tolerant size, which ismainly responsible for triggering interface failures under thermal load. Thus, it can be used to assess the interface integrity and reliability under thermal load. On the other hand, the practical interface crack.
Author(s): Ma L, He R, Zhang J, Shaw B
Publication type: Article
Publication status: Published
Journal: Acta Mechanica
Print publication date: 01/07/2013
ISSN (print): 0001-5970
ISSN (electronic): 1619-6937
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