Lookup NU author(s): Nizar Dahir,
Dr Terrence Mak,
Professor Alex Yakovlev
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The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces serious thermal threats that would lead to faults and system failures. This article introduces a new strategy to effectively diffuse heat from NoC-based 3D CMPs. Runtime Dynamic Programming Network (DPN) is proposed to optimize routing directions and provide silicon temperature moderation. Both on-chip reliability and computational performance have been improved by 63% and 27%, respectively, with the DPN approach. This work enables a new avenue to explore the adaptability for future large-scale 3D integration.
Author(s): Dahir N, Al-Dujaily R, Mak T, Yakovlev A
Publication type: Article
Publication status: Published
Journal: ACM Transactions on Embedded Computing Systems (TECS)
Print publication date: 01/07/2014
ISSN (print): 1539-9087
ISSN (electronic): 1558-3465
Publisher: Assocation for Computing Machinery, Inc.
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