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Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

Lookup NU author(s): Dr Xiuyun Zhou, Professor Gui Yun TianORCiD

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Abstract

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

Publication metadata

Author(s): Zhou X, Zhou J, Tian G, Wang Y

Publication type: Article

Publication status: Published

Journal: Sensors

Year: 2015

Volume: 15

Issue: 10

Pages: 25882-25897

Online publication date: 13/10/2015

Acceptance date: 14/09/2015

Date deposited: 21/03/2016

ISSN (electronic): 1424-8220

Publisher: MDPI AG

URL: http://dx.doi.org/10.3390/s151025882

DOI: 10.3390/s151025882

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