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A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores

Lookup NU author(s): Ammar Karkar, Dr Terrence Mak, Professor Alex Yakovlev

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This is the authors' accepted manuscript of an article that has been published in its final definitive form by Institute of Electrical and Electronics Engineers, 2016.

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Abstract

Networks-on-chip (NoC) have emerged to tackle different on-chip communication challenges and can satisfy different demands in terms of performance, cost and reliability. Currently, interconnects based on metal are reaching performance limits given relentless technology scaling. In particular, a performance bottleneck has emerged due to the demands for communication in terms of bandwidth for multicasting and broadcasting. As a result, various state-of-the-art architectures have been proposed as alternatives and emerging interconnects including the use of optics or radio frequency (RF). This article presents a comprehensive survey of these various interconnect fabrics, and discusses their current and future potentials and obstacles as well. This article aims to drive the research community to achieve a better utilization of the merits of on-chip interconnects and addresses the challenges involved. New interconnect technologies, such as optical interconnect, wireless NoC (WiNoC), RF transmission lines (RF-I) and surface wave interconnects (SWI), are discussed, evaluated and compared. Consequently, these emerging interconnects can continue to provide the cost efficiency and performance that are highly demanded for future many-core processors and high performance computing.


Publication metadata

Author(s): Karkar A, Mak T, Tong KF, Yakovlev A

Publication type: Article

Publication status: Published

Journal: IEEE Circuits and Systems Magazine

Year: 2016

Volume: 16

Issue: 1

Pages: 58-72

Online publication date: 12/02/2016

Acceptance date: 01/01/1900

ISSN (print): 1531-636X

ISSN (electronic): 1558-0830

Publisher: Institute of Electrical and Electronics Engineers

URL: http://dx.doi.org/10.1109/MCAS.2015.2510199

DOI: 10.1109/MCAS.2015.2510199


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