Lookup NU author(s): Zi Choong,
Dr Dehong Huo,
Dr Patrick Degenaar,
Professor Anthony O'Neill
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Silicon is a crystalline material commonly used for semiconductor device manufacturing and MEMS applications. Due to its brittle nature, excessive generation of undesirable surface and subsurface damages such as edge chipping, occurs when attempted to machine at depths of several hundreds of microns. In this study, the micro-machinability experiment of silicon using single crystal diamond tool was conducted. The aim was to investigate the effects of machining conditions during silicon micro-milling and thus optimising the cutting strategy to reduce edge chipping generation. Full slot milling were performed along <100> and <110> directions on a (001) surface silicon wafer under various machining conditions. Results show that smaller scale of edge chipping was generated with proper machining conditions control at low cutting speed, low feed per tooth, small depth of cut and machining along <100>. In addition, ductile mode machining, generating good machined surface quality, was seen to predominate the cutting process at low feed per tooth of 0.2 μm/tooth and below in the size effect studies for silicon micro-milling.
Author(s): Choong ZJ, Huo D, Degenaar P, O'neill A
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 16th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN 2016)
Year of Conference: 2016
Online publication date: 03/06/2016
Acceptance date: 02/04/2016
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