Lookup NU author(s): Dr Stevin Pramana
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We present a method to improve the overall properties of sintered alumina substrate via iron doping that has a higher fracture toughness, lower thermal conductivity, lower thermal expansion coefficient and comparable dielectric constant than pure alumina. Such properties are beneficial for harsh environment electronic packages. X-ray and electron probe microanalyses concluded that toughening is likely caused by multiple phase strengthening and ruled out crack bridging or grain boundary strengthening.© 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Author(s): Made RI, Phua EJR, Pramana SS, Wong CC, Chen Z, Tok AIY, Gan CL
Publication type: Article
Publication status: Published
Journal: Scripta Materialia
Print publication date: 01/06/2013
Online publication date: 21/02/2013
ISSN (print): 1359-6462
Publisher: Pergamon Press
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