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Study of metal additives to alumina substrate for high temperature and pressure application

Lookup NU author(s): Dr Stevin Pramana

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Abstract

In this work, we present systematical characterizations of iron doped alumina substrates produced by solid state sintering of ball milled powders. It was found that the doped samples have higher fracture toughness, lower thermal conductivity, smaller coefficient of thermal expansion and higher relative dielectric constant than undoped ones. A reduction in thermal conductivity could arguably give extra protection to the package chip in a high temperature application environment and can be attributed to an increase in phonon scattering. Furthermore, the decrease in coefficient of thermal expansion also helps to reduce thermal induced stress between the substrates and device chip. The observed improvement in fracture toughness cannot be explained by the common toughening mechanism, such as crack bridging or due to the increase in crystallite size, and is the subject of further investigation. © 2012 IEEE.


Publication metadata

Author(s): Riko IM, Pramana SS, Rong EPJ, Cheong WC, Zhong C, Yoong ATI, Lip GC

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC 2012)

Year of Conference: 2012

Pages: 48-51

Online publication date: 29/04/2013

Publisher: IEEE

URL: https://doi.org/10.1109/EPTC.2012.6507049

DOI: 10.1109/EPTC.2012.6507049

Library holdings: Search Newcastle University Library for this item

ISBN: 9781467345514


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