Lookup NU author(s): Zi Choong,
Dr Dehong Huo,
Dr Patrick Degenaar,
Professor Anthony O'Neill
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This research aims to investigate the feasibility of a novel hybrid manufacturing process, developed to machine monocrystalline silicon with reduced surface defects, such as edge chipping. Edge chipping is commonly observed, when mechanically machined at several hundreds of microns of depth. Hence, the process reduces edge chipping generation by depositing copper as a sacrificial layer onto the silicon's surface. It protects the surface against shock loading contributed by the micro-end-mills during micro-milling by acting as an energy buffer. Full slot micro-milling was performed along the  direction on a (001) silicon at 30, 50 and 100 μm of total machining depths. Chemical etching was used to remove the copper after machining. Similar experiment was also performed on an uncoated silicon workpiece for comparison. Scanning electron microscope (SEM) was used to measure the generated edge chipping in terms of length. Measurement was conducted by measuring the average length of the chipped surface along the top SEM image view on each machined slot. Using copper as a sacrificial layer, generation of edge chipping was significantly reduced. Additionally, edge chipping was absent below the total machining depth of 50 μm.
Author(s): Choong ZJ, Huo D, Degenaar P, O'Neill A
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
Year of Conference: 2017
Acceptance date: 01/01/1900
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