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Lookup NU author(s): Adi Marindra, Professor Gui Yun TianORCiD
This is the final published version of an article that has been published in its final definitive form by IEEE, 2018.
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OAPA Chipped radio-frequency identification (RFID) sensor systems have been studied for structural health monitoring (SHM) applications. However, the use of chip in sensor tags and its standardized narrowband operation contribute shortcomings in cost, durability, and detection capability. This paper presents a novel use of the frequency signature-based chipless RFID for metal crack detection and characterization operating in ultra-wideband frequency. The vision is to implement a low-cost and high-temperature-resistant passive wireless sensor able to monitor the crack on a metallic structure with multiparameter detection. We propose a chipless RFID sensor tag integrating four tip-loaded dipole resonators as a 4-bit ID encoder and a circular microstrip patch antenna (CMPA) resonator as a crack sensor. The radar cross section spectrum of the chipless RFID sensor tag generates four resonant frequencies from the dipole resonators and a resonant frequency from the CMPA resonator. Simulation and experimental results show that the resonant frequency shift of the CMPA is a useful feature to indicate the crack orientation and the crack width on a metallic structure. The direction of the resonant frequency shift represents the orientation of the crack, while the magnitude of the resonant frequency shift is proportional to the width of the crack. Furthermore, the experimentation with a natural fatigue crack sample proves that the proposed sensor tag is capable of detecting submillimeter cracks.
Author(s): Marindra AMJ, Tian GY
Publication type: Article
Publication status: Published
Journal: IEEE Transactions on Microwave Theory and Techniques
Year: 2018
Volume: 66
Issue: 5
Pages: 2452-2462
Print publication date: 01/05/2018
Online publication date: 07/03/2018
Acceptance date: 02/04/2016
Date deposited: 27/06/2018
ISSN (print): 0018-9480
ISSN (electronic): 1557-9670
Publisher: IEEE
URL: https://doi.org/10.1109/TMTT.2017.2786696
DOI: 10.1109/TMTT.2017.2786696
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