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Overview study of on-chip interconnect modelling approaches and its trend

Lookup NU author(s): Mohammed Al-Daloo, Professor Alex Yakovlev

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Abstract

© 2018 IEEE. Several techniques related to the interconnect structure analysing and the modelling were outlined. Emphasis has been placed on modelling approach, starting from a one-dimensional and simple lumped issue and stretching to be a more general three-dimensional nonuniform problem. In addition, the advantages and disadvantages of each approach have highlighted to state the importance of these models for further research and their prospects. That verified through studying the approaches principles and an uncomplicated comparison.


Publication metadata

Author(s): Al-daloo M, Soltan A, Yakovlev A

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: 7th International Conference on Modern Circuits and Systems Technologies (MOCAST 2018)

Year of Conference: 2018

Pages: 1-5

Online publication date: 11/06/2018

Acceptance date: 07/05/2018

Publisher: IEEE

URL: https://doi.org/10.1109/MOCAST.2018.8376647

DOI: 10.1109/MOCAST.2018.8376647

Library holdings: Search Newcastle University Library for this item

ISBN: 9781538647882


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