Browse by author
Lookup NU author(s): Dr Arti Yadav, Professor Steve BullORCiD
Full text for this publication is not currently held within this repository. Alternative links are provided below where available.
Metallic nanowire networks are emerging as potential replacements for transparent conducting oxide coatings because of their high conductivity, flexibility and relative transparency. However, a cheap, reliable and controlled manufacturing process is required to exploit this and the surface of the copper nanowire needs to be protected if high conductivity is to be retained. In this study a fabrication method for highly aligned and densely packed copper nanowires with controlled length using pulse-electrodeposition and a nanoporous alumina template has been developed. Nanoporous alumina was obtained by anodisation of pure aluminum in oxalic acid using a two-step anodisation process. In order to provide the conductivity at the bottom of the pores, a dendritic structure at the interface was created through the stepwise voltage reduction method with a voltage reduction rate of 15 V/s followed by mild chemical etching. Highly repeatable near 100% filling of copper is achieved. Copper nanowire length was highly controllable from 100 nm to 2 μm with a fixed diameter of 60 ± 5 nm by monitoring current density during the deposition. Such controlled growth of Cu nanowires could lead towards transparent conducting layer applications but the protection of the material against oxidation remains an issue.
Author(s): Yadav A, Bobji MS, Bull SJ
Publication type: Article
Publication status: Published
Journal: Journal of Nanoscience and Nanotechnology
Year: 2019
Volume: 19
Issue: 7
Pages: 4254-4259
Print publication date: 01/07/2019
Online publication date: 25/02/2019
Acceptance date: 02/04/2018
ISSN (print): 1533-4880
ISSN (electronic): 1533-4899
Publisher: American Scientific Publishers
URL: https://doi.org/10.1166/jnn.2019.16868
DOI: 10.1166/jnn.2019.16868
PubMed id: 30765001
Altmetrics provided by Altmetric
