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Localization and Detection of Bond Wire Faults in Multi-chip IGBT Power Modules

Lookup NU author(s): Cuili Chen, Professor Volker Pickert, Dr Maher Al-Greer



This is the authors' accepted manuscript of an article that has been published in its final definitive form by IEEE, 2020.

For re-use rights please refer to the publisher's terms and conditions.

Publication metadata

Author(s): Chen C, Pickert V, Al-Greer M, Jia C, NG C

Publication type: Article

Publication status: Published

Journal: IEEE Transactions on Power Electronics

Year: 2020

Pages: ePub ahead of print

Online publication date: 08/01/2020

Acceptance date: 26/12/2019

Date deposited: 05/01/2020

ISSN (print): 0885-8993

ISSN (electronic): 1941-0107

Publisher: IEEE


DOI: 10.1109/TPEL.2020.2965019


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