ePrints

On the application of liquid metal cooling for electronic switching devices

Lookup NU author(s): Dr Tom WernerORCiD, Professor Volker Pickert

Downloads

• Accepted version [.pdf]

Licence

This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).

Abstract

© 2023Increasingly smaller and lighter power electronics converters are needed for the advancement of electrified transport. The development of high heat flux heat sinks is imperative to maintain modern converters at an operable temperature. So far, liquid metal based heat sinks have not received as much attention as other solutions, yet they provide a multitude of benefits beyond their superior thermal conductivity. Their use with compact magnetohydrodynamic pumping systems, straight-forward incorporations of active cooling techniques, elimination of water corrosion issues in power converter systems using press-pack IGBT's and a significant increase in thermal performance in conventional pin–fin structures are demonstrated in this paper. Some additional functionalities of liquid metal systems which could be explored in the future are also highlighted.

Publication metadata

Author(s): Yerasimou Y, Werner TC, Pickert V

Publication type: Article

Publication status: Published

Journal: Thermal Science and Engineering Progress

Year: 2023

Volume: 42

Print publication date: 01/07/2023

Online publication date: 29/04/2023

Acceptance date: 28/04/2023

Date deposited: 10/07/2023

ISSN (print): 2451-9049

Publisher: Elsevier Ltd

URL: https://doi.org/10.1016/j.tsep.2023.101875

DOI: 10.1016/j.tsep.2023.101875

ePrints DOI: 10.57711/fcxc-m390

Altmetrics

Share