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Calibration and optimization of interconnect based MEMS test structures for predicting thermo-mechanical stress in metallization

Lookup NU author(s): Dr Alton Horsfall, Professor Nick Wright, Professor Anthony O'Neill, Sorin Soare, Professor Steve Bull

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Abstract

We have shown that the in-plane stress in aluminium metallisation can be observed using a rotating beam sensor structure. This shows that the extrinsic stress from the mismatch in expansion coefficient between the aluminium and the silicon substrate dominates over the compressive stress from the sputter growth. Sintering the layers at temperatures above 150°C reduces this compressive stress due to the action of creep. Calibration of the rotation of the device has been undertaken by direct comparison to high resolution x-ray diffraction measurements and these show that the sensor has a resolution better than 2.8MPa.


Publication metadata

Author(s): Dos Santos JMM, Horsfall AB, Pina JCP, Wright NG, O'Neill AG, Wang K, Soare SM, Bull SJ, Terry JG, Walton AJ, Gundlach AM, Stevenson JTM

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: 42nd Annual IEEE International Reliability Physics Symposium

Year of Conference: 2004

Pages: 255-258

Publisher: IEEE

URL: http://dx.doi.org/10.1109/RELPHY.2004.1315333

DOI: 10.1109/RELPHY.2004.1315333

Library holdings: Search Newcastle University Library for this item

ISBN: 078038315X


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