Toggle Main Menu Toggle Search

Open Access padlockePrints

First principles derivation of carrier transport across metal - SiC barriers

Lookup NU author(s): Dr Alton Horsfall, Professor Nick Wright, Dr Christopher Johnson, Dr Konstantin VasilevskiyORCiD, Professor Anthony O'Neill

Downloads

Full text for this publication is not currently held within this repository. Alternative links are provided below where available.


Abstract

There have been several attempts to describe the electrical characteristic of metal - SiC Barriers using a range of theoretical approaches. These generally rely on approximations to the Quantum Mechanical (QM) transport model for the barrier and are best suited to a restricted set of bias and temperature conditions. In this work a full QM model is used to derive the current-voltage characteristics for a metal-SiC barrier. The probability for carriers to traverse the potential barrier is calculated numerically using a transfer matrix method. This probability is related to the current density and enables the numerical calculation of the current density through the Schottky Barrier Diode (SBD). The paper utilises a single set of parameters (barrier height and effective Richardson constant) determined from the forward characteristics of the diodes which are subsequently utilised in the modelling of both forward and reverse characteristics. The currents calculated using the QM theory are compared with results obtained utilising other approximate theories (which are using the same set of parameters as QM, in both forward and reverse) to show that only QM provides a good fit for both forward and reverse bias over a wide range of temperatures and voltages using a single set of parameters.


Publication metadata

Author(s): B-Dimitriu C, Horsfall AB, Wright NG, Johnson CM, Vassilevski KV, O'Neill AG

Editor(s): Madar, R., Camassal, J., Blanquet, E.

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Materials Science Forum: 10th International Conference on Silicon Carbide and Related Materials (ICSCRM)

Year of Conference: 2004

Pages: 969-972

ISSN: 0255-5476 (print) 1422-6375 (online)

Publisher: Trans Tech Publications Ltd

URL: http://dx.doi.org/10.4028/www.scientific.net/MSF.457-460.969

DOI: 10.4028/www.scientific.net/MSF.457-460.969


Share