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Finite element analysis of copper wire bonding in integrated circuit devices

Lookup NU author(s): Norzalina Ismail, Dr Kheng-Lim Goh

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Publication metadata

Author(s): Dastgir N, Pasbakhsh P, Guo NQ, Ismail N, Goh KL

Publication type: Article

Journal: Advanced Materials Research

Year: 2012

Volume: 566

Pages: 293-299

Print publication date: 01/09/2012

ISSN (print): 1022-6680

Publisher: Trans Tech Publications Ltd.

URL: http://dx.doi.org/10.4028/www.scientific.net/AMR.566.293

DOI: 10.4028/www.scientific.net/AMR.566.293


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