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Calibration of MEMS-based test structures for predicting thermomechanical stress in integrated circuit interconnect structures

Lookup NU author(s): Kai Wang, Dr Alton Horsfall, Professor Nick Wright, Professor Anthony O'Neill, Sorin Soare, Professor Steve Bull

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Author(s): dos Santos JMM, Wang K, Horsfall AB, Pina JCP, Wright NG, O'Neill AG, Soare SM, Bull SJ, Terry JG, Walton AJ, Gundlach AM, Stevenson JTM

Publication type: Article

Journal: IEEE Transactions on Device and Materials Reliability

Year: 2005

Volume: 5

Issue: 4

Pages: 713-719

Print publication date: 01/12/2005

ISSN (print): 1530-4388

ISSN (electronic): 1558-2574

Publisher: IEEE

URL: http://dx.doi.org/10.1109/TDMR.2005.857218

DOI: 10.1109/TDMR.2005.857218


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