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Test chip for the development and evaluation of sensors for measuring stress in metal interconnects

Lookup NU author(s): Dr Alton Horsfall, Sorin Soare, Professor Nick Wright, Professor Anthony O'Neill, Professor Steve Bull

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Author(s): Terry JG, Smith S, Walton AJ, Gundlach AM, Stevenson JTM, Horsfall AB, Wang K, Dos Santos JMM, Soare SM, Wright NG, O'Neill AG, Bull SJ

Publication type: Article

Journal: IEEE Transactions on Semiconductor Manufacturing

Year: 2005

Volume: 18

Issue: 2

Pages: 255-260

ISSN (print): 0894-6507

ISSN (electronic): 1476-5527

Publisher: IEEE

URL: http://dx.doi.org/10.1109/TSM.2005.845096

DOI: 10.1109/TSM.2005.845096


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